Multilayered ceramic electronic component and board for mounting the same

ABSTRACT

There is provided a multilayered ceramic electronic component including a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W&gt;1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second main surfaces, first and second end surfaces, and first and second side surfaces, a plurality of first and second internal electrodes, and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, include first and second head parts formed on the first and second end surfaces, and first and second band parts formed on the first and second main surfaces, and are not formed on the first and second side surfaces.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority of Korean Patent Application No.10-2013-0046834 filed on Apr. 26, 2013, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a multilayered ceramic electroniccomponent and a board for mounting the same.

2. Description of the Related Art

In accordance with the recent trend toward miniaturization of electronicproducts, the demand for a multilayer ceramic electronic componenthaving a small size and high capacitance has increased.

Therefore, a dielectric layer and an internal electrode have beenthinned and multilayered through various methods. Recently, as athickness of the dielectric layer has been thinned, the multilayerceramic electronic components in which the number of stacked layers isincreased have been manufactured.

As the multilayered ceramic electronic component has been miniaturizedand the thicknesses of the dielectric layer and the internal electrodehave been reduced, the number of stacked layers has been increased toallow for the implementation of high capacitance.

As described above, the multilayered ceramic electronic component isminiaturized and the number of stacked layers is increased, such thatthe multilayered ceramic electronic component has a thickness greaterthan a width, thereby implementing high capacitance. However, a defectin which a chip topples over when the multilayered ceramic electroniccomponent is mounted on a board may be frequently generated.

Therefore, research into a technology of enhancing device reliability bypreventing the occurrence of defect in which the multilayered ceramicelectronic component topples over and the chipping defect at the time ofbeing mounted on the board while implementing the high capacitance isrequired.

RELATED ART DOCUMENT

Japanese Patent Laid-Open Publication No. JP 2005-129802

SUMMARY OF THE INVENTION

An aspect of the present invention provides a multilayered ceramicelectronic component and a board for mounting the same.

According to an aspect of the present invention, there is provided amultilayered ceramic electronic component including: a ceramic bodyhaving a hexahedral shape, including a dielectric layer, satisfyingT/W>1.0 when a length thereof is L, a width thereof is W, and athickness thereof is T, and having first and second main surfacesopposing each other in a thickness direction, first and second endsurfaces opposing each other in a length direction, and first and secondside surfaces opposing each other in a width direction; a plurality offirst and second internal electrodes disposed in the ceramic body so asto be alternately exposed through the first and second end surfaces,having the dielectric therebetween; and first and second externalelectrodes electrically connected to the first and second internalelectrodes, respectively, wherein the first and second externalelectrodes are electrically connected to the exposed portions of thefirst and second internal electrodes, respectively, include first andsecond head parts formed on the first and second end surfaces,respectively, and first and second band parts formed on the first andsecond main surfaces, respectively, and are not formed on the first andsecond side surfaces.

L/W>1.0 may be satisfied.

The first and second internal electrodes may be stacked in the thicknessdirection of the ceramic body.

The first and second internal electrodes may be stacked in the widthdirection of the ceramic body.

When an average thickness of the dielectric layer is td, 0.1 μm≦td≦0.6μm may be satisfied.

A thickness of each of the first and second internal electrodes may be0.6 μm or less.

The number of stacked dielectric layers may be 500 and more.

According to an aspect of the present invention, there is provided amultilayered ceramic electronic component including: a ceramic bodyhaving a hexahedral shape, including a dielectric layer, satisfyingT/W>1.0 when a length thereof is L, a width thereof is W, and athickness thereof is T, and having first and second end surfacesopposing each other in a length direction and first and second sidesurfaces opposing each other in a width direction; a plurality of firstand second internal electrodes disposed in the ceramic body to bealternately exposed through the first and second end surfaces, havingthe dielectric therebetween; first and second external electrodeselectrically connected to the first and second internal electrodes,respectively; and insulation layers formed on the first and second sidesurfaces, wherein the insulation layers cover regions of the first andsecond external electrodes formed on the first and second side surfaces.

L/W>1.0 may be satisfied.

The first and second internal electrodes may be stacked in a thicknessdirection of the ceramic body.

The first and second internal electrodes may be stacked in the widthdirection of the ceramic body.

When an average thickness of the dielectric layer is td, 0.1 μm≦td≦0.6μm may be satisfied.

A thickness of each of the first and second internal electrodes may be0.6 μm or less.

The number of stacked dielectric layers may be 500 and more.

According to an aspect of the present invention, there is provided aboard for mounting a multilayered ceramic electronic component, theboard including: a printed circuit board having first and secondelectrode pads disposed thereon; and a multilayered ceramic electroniccomponent installed on the printed circuit board, wherein themultilayered ceramic electronic component includes: a ceramic bodyhaving a hexahedral shape, including a dielectric layer, satisfyingT/W>1.0 when a width thereof is W, and a thickness thereof is T, andhaving first and second main surfaces opposing each other in a thicknessdirection, first and second end surfaces opposing each other in a lengthdirection, and first and second side surfaces opposing each other in awidth direction; a plurality of first and second internal electrodesdisposed in the ceramic body to be alternately exposed through the firstand second end surfaces, having the dielectric layer therebetween; andfirst and second external electrodes electrically connected to the firstand second internal electrodes, respectively, and wherein the first andsecond external electrodes are electrically connected to the exposedportions of the first and second internal electrodes, respectively,include first and second head parts formed on the first and second endsurfaces, respectively, and first and second band parts formed on thefirst and second main surfaces, respectively, and are not formed on thefirst and second side surfaces.

According to an aspect of the present invention, there is provided aboard for mounting a multilayered ceramic electronic component, theboard including: a printed circuit board having first and secondelectrode pads disposed thereon; and a multilayered ceramic electroniccomponent installed on the printed circuit board, wherein themultilayered ceramic electronic component includes: a ceramic bodyhaving a hexahedral shape, including a dielectric layer, satisfyingT/W>1.0 when a width thereof is W, and a thickness thereof is T, andhaving first and second end surfaces opposing each other in a lengthdirection, and first and second side surfaces opposing each other in awidth direction; a plurality of first and second internal electrodesdisposed in the ceramic body to be alternately exposed through the firstand second end surfaces, having the dielectric therebetween; first andsecond external electrodes electrically connected to the first andsecond internal electrodes, respectively; and insulation layers formedon the first and second side surfaces, and the insulation layers coverregions of the first and second external electrodes formed on the firstand second side surfaces.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a partially cut-away perspective view schematically showing amultilayered ceramic electronic component according to a firstembodiment of the present invention;

FIG. 2 is a cross-sectional view showing an L-W cross section of themultilayered ceramic electronic component of FIG. 1;

FIG. 3 is a partially cut-away perspective view schematically showing amultilayered ceramic electronic component according to a secondaryembodiment of the present invention;

FIG. 4 is a cross-sectional view showing an L-W cross section of themultilayered ceramic electronic component of FIG. 3;

FIG. 5 is a partially cut-away perspective view schematically showing amultilayered ceramic electronic component according to a thirdembodiment of the present invention;

FIG. 6 is a cross-sectional view showing an L-W cross section of themultilayered ceramic electronic component of FIG. 5;

FIG. 7 is a partially cut-away perspective view schematically showing amultilayered ceramic electronic component according to a fourthembodiment of the present invention;

FIG. 8 is a cross-sectional view showing an L-W cross section of themultilayered ceramic electronic component of FIG. 7;

FIG. 9 is a perspective view schematically showing aboard for mountingthe multilayered ceramic electronic component according to theembodiment of the present invention; and

FIG. 10 is a perspective view schematically showing a board for mountinga multilayered ceramic electronic component according to anotherembodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. The invention may,however, be embodied in many different forms and should not be construedas being limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the invention to thoseskilled in the art.

Hereinafter, the multilayered ceramic electronic component according tothe embodiment of the present invention will be described. Particularly,a multilayered ceramic capacitor will be described. However, the presentinvention is not limited thereto.

Multilayered Ceramic Capacitor

Hereinafter, embodiments of the present invention will now be describedin detail with reference to the accompanying drawings.

FIG. 1 is a partially cut-away perspective view schematically showing amultilayered ceramic capacitor according to a first embodiment of thepresent invention.

FIG. 2 is an L-W cross-sectional view illustrating the multilayeredceramic capacitor of FIG. 1 cut in a thickness direction.

Referring to FIGS. 1 and 2, the multilayered ceramic electroniccomponent according to the first embodiment of the present invention mayinclude: a ceramic body 10 having a hexahedral shape, including adielectric layer 11, satisfying T/W>1.0 when a length thereof is L, awidth thereof is W, and a thickness thereof is T, and having first andsecond main surfaces opposing each other in a thickness direction, firstand second end surfaces opposing each other in a length direction, andfirst and second side surfaces opposing each other in a width direction;a plurality of first and second internal electrodes 21 and 22 disposedin the ceramic body to be alternately exposed through the first andsecond end surfaces, having the dielectric layer therebetween; and firstand second external electrodes 31 and 32 electrically connected to thefirst and second internal electrodes, respectively.

The ceramic body 10 is not particularly limited, and for example, mayhave a hexahedral shape.

Meanwhile, in the multilayered ceramic capacitor according to theembodiment (the first embodiment) of the present invention, a ‘lengthdirection’ refers to an ‘L’ direction, a ‘width direction’ refers to a‘W’ direction, and a ‘thickness direction’ refers to a ‘T’ direction ofFIG. 1. Here, the ‘thickness direction’ is the same as a direction inwhich the dielectric layers are stacked, that is, a ‘stackingdirection’.

According to the embodiment of the present invention, the ceramic body10 may have first and second side surfaces opposing each other in awidth direction, first and second end surfaces opposing each other in alength direction, and first and second main surfaces opposing each otherin a thickness direction.

The multilayered ceramic capacitor 1 according to the embodiment of thepresent invention may include: a ceramic body 10 having a hexahedralshape, including a dielectric layer 11, and satisfying T/W>1.0 when alength thereof is L, a width thereof is W, and a thickness thereof is T;and first and second internal electrodes 21 and 22 stacked in theceramic body 10 so as to face each other, having the dielectric layer 11therebetween.

A material for forming the first and second internal electrodes 21 and22 is not particularly limited. For example, the first and secondinternal electrodes 21 and 22 may be formed by using a noble metalmaterial such as palladium (Pd), a palladium-silver (Pd—Ag) alloy, orthe like, and a conductive paste formed of at least one of nickel (Ni)and copper (Cu).

The dielectric layer 11 may include a ceramic material having highdielectric constant, for example, a barium titanate (BaTiO₃) basedpowder, or a strontium titanate (SrTiO₃) based powder. However, thepresent invention is not limited thereto.

Meanwhile, the first and second internal electrodes 21 and 22, a pair ofelectrodes having different polarities, may be formed by printing aconductive paste including a conductive metal on the dielectric layer 11at a predetermined thickness.

The average thickness of each of the first and second internalelectrodes 21 and 22 after the sintering process is not particularlylimited as long as the internal electrode may have capacitance. Forexample, the average thickness of each of the first and second internalelectrodes may be 0.6 μm or less.

The average thickness of each of the internal electrodes 21 and 22 maybe measured by scanning a cross-section of the ceramic body 10 in awidth direction as an image using scanning electron microscope (SEM).

For example, the average thickness of the internal electrode may becalculated by measuring thicknesses of the internal electrode at thirtyequidistant points in a width direction in an image obtained by scanninga cross section taken at the central portion of the ceramic body 10 in awidth-thickness (W-T) direction cut in a length direction L using thescanning electron microscope (SEM).

The thirty equidistant points in a width direction may be measured in acapacitance forming part, wherein the capacitance forming part refers toa region in which the first and second internal electrodes 21 and 22 areoverlapped with each other.

In addition, in the case in which the average value measurement isapplied to at least 10 internal electrodes to measure the average valuesof at least 10 internal electrodes, the average thickness of theinternal electrode may be significantly generalized.

Further, the first and second internal electrodes 21 and 22 may beformed so as to be alternately exposed through both end surfaces, in astacking direction of the dielectric layer 11, and may be electricallyinsulated from each other by the dielectric layer 11 disposedtherebetween.

That is, the first and second internal electrodes 21 and 22 may beelectrically connected to the first and second external electrodes 31and 32, respectively, through portions thereof alternately exposedthrough both end surfaces of the ceramic body 10.

Therefore, in the case in which voltage is applied to the first andsecond external electrodes 31 and 32, electric charges are accumulatedbetween the first and second internal electrodes 21 and 22 facing eachother. Here, capacitance of the multilayered ceramic capacitor 1 is inproportion to an area of a region in which the first and second internalelectrodes 21 and 22 are overlapped with each other.

In order to form the capacitance, the first and second externalelectrodes 31 and 32 may be formed on outer surfaces of the ceramic body10, and may be electrically connected to the first and second internalelectrodes 21 and 22.

The first and second external electrodes 31 and 32 may be formed of thesame conductive materials as that of the internal electrode, but are notlimited thereto. For example, the external electrodes 31 and 32 may beformed of copper (Cu), silver (Ag), nickel (Ni), or the like.

The first and second external electrodes 31 and 32 may be formed byapplying a conductive paste prepared by adding glass frit to the metalpowder and performing a sintering process.

The ceramic body 10 may be formed by stacking a plurality of dielectriclayers 11 and performing a sintering process, wherein a shape and adimension of the ceramic body 10, and the number of stacked dielectriclayers 11 are described in the embodiment of the present invention, butthe present invention is not limited thereto.

In addition, the plurality of dielectric layers 11 forming the ceramicbody 10 may be in a sintered state. Dielectric layers 11 adjacent toeach other may be integrated so as to be difficult to confirm a boundarytherebetween without using the scanning electron microscope (SEM).

According to the embodiment of the present invention, an averagethickness td of the dielectric layer 11 may be arbitrarily changedaccording to a capacitance design of the multilayered ceramic capacitor1, but may be 0.1 to 0.6 μm after performing the sintering process.

The average thickness td of the dielectric layer 11 may be measured byscanning the cross-section of the ceramic body 10 in a width directionas an image using the SEM.

For example, the average thickness of a dielectric layer may becalculated by measuring thicknesses of the dielectric layer at thirtyequidistant points in a width direction in an image obtained by scanninga cross section taken at the central portion of the ceramic body 10 in awidth-thickness (W-T) direction cut in a length direction L using thescanning electron microscope (SEM).

The thirty equidistant points in a width direction may be measured in acapacitance forming part, wherein the capacitance forming part refers toa region in which the first and second internal electrodes 21 and 22 areoverlapped with each other.

In addition, in the case in which the average value measurement isapplied to at least 10 dielectric layers to measure the average valuesof at least 10 dielectric layers, the average thickness of thedielectric layer may be significantly generalized.

The number of stacked dielectric layers 11 is not particularly limited,but for example, may be 500 layers or more.

As described above, the number of stacked dielectric layers 11 is 500 ormore, such that the multilayered ceramic capacitor having highcapacitance and having a thickness T of the ceramic body greater than awidth W thereof may be implemented.

Meanwhile, when a length of the ceramic body 10 is L, a width thereof isW, and a thickness thereof is T, T/W>1.0 may be satisfied.

In the multilayered ceramic capacitor 1 according to the embodiment ofthe present invention, the number of stacked dielectric layers may beincreased to allow for the implementation of high capacitance, such thatthe ceramic body 10 may have a thickness T thereof greater than a widthW thereof.

A general multilayered ceramic capacitor has been manufactured so that awidth and a thickness thereof have the approximately same size as eachother.

However, since the multilayered ceramic capacitor according to theembodiment of the present invention may be miniaturized, a sufficientspace for being mounted on the board may be secured, such that thenumber of stacked layers may be increased in order to allow for theimplementation of the multilayered ceramic capacitor having highcapacitance.

The number of stacked layers is increased as described above, and astacking direction in the ceramic body is a thickness direction, suchthat a relationship between a thickness T and a width W of the ceramicbody may satisfy T/W>1.0.

The multilayered ceramic capacitor is manufactured so that therelationship between the thickness T and the width W of the ceramic bodysatisfies T/W>1.0, such that the multilayered ceramic capacitor maytopple over at the time of being mounted on the board to cause ashort-circuit, that is, there may be problems in reliability.

In particular, the multilayered ceramic capacitor may be manufactured sothat the relationship between the length L and the width W of theceramic body satisfies L/W>1.0.

In the case in which the multilayered ceramic capacitor is manufacturedso that the ceramic body satisfies T/W>1.0 and L/W>1.0 as described inthe embodiment of the present invention, a case in which themultilayered ceramic capacitor topples over in a width direction at thetime of being mounted on the board may be frequently generated ascompared to a case in which the multilayered ceramic capacitor topplesover in a length direction.

Therefore, the multilayered ceramic capacitor is manufactured so thatthe external electrode is not formed on the first and second sidesurfaces of the ceramic body opposing each other in the width direction,such that even when the multilayered ceramic capacitor topples over atthe time of being mounted on the board, the short-circuit caused by thecontact between the external electrodes may be prevented.

That is, according to the embodiment of the present invention, the firstand second external electrodes may include first and second head partsformed on the first and second end surfaces opposing each other,respectively, and first and second band parts formed by extending thefirst and second head parts to the first and second main surfaces,wherein the external electrodes may not be formed on the first andsecond side surfaces.

The external electrode having the above-described shape may be obtainedby performing a screen printing method on the ceramic body using a pastefor external electrode, and may be obtained by removing the externalelectrode formed on the side surface in the case in which the ceramicbody is dipped in the paste for external electrode.

Therefore, since the external electrode is not formed on the sidesurface of the ceramic body, even when the multilayered ceramic bodytopples over at the time of being mounted on the board, theshort-circuit may not be generated, such that the multilayered ceramiccapacitor may have excellent reliability, and the multilayered ceramiccapacitors may be mounted to have the interval therebetween shorter thanthat of the multilayered ceramic capacitor according to the related art,thereby improving a mounting density.

FIG. 3 is a partially cut-away perspective view schematically showing amultilayered ceramic capacitor according to a secondary embodiment ofthe present invention.

FIG. 4 is an L-W cross-sectional view shown illustrating themultilayered ceramic capacitor of FIG. 3 cut in a thickness direction.

Referring to FIGS. 3 and 4, in the multilayered ceramic capacitor 100according to the secondary embodiment of the present invention, a‘length direction’ refers to an ‘L’ direction of FIG. 3, a ‘widthdirection’ refers to a ‘W’ direction thereof, and a ‘thicknessdirection’ refers to a ‘T’ direction thereof. Here, the ‘widthdirection’ may be the same as a direction in which dielectric layers arestacked, that is, a ‘stacking direction’.

That is, as shown in FIGS. 3 and 4, in the multilayered ceramiccapacitor 100 according to the secondary embodiment of the presentinvention, the direction in which the dielectric layers are stacked maybe the width direction of the ceramic body 110, unlike theabove-described multilayered ceramic capacitor according to the firstembodiment of the present invention.

When the multilayered ceramic capacitor 100 according to the secondaryembodiment of the present invention is mounted on the board to bedescribed below, the multilayered ceramic capacitor 100 may bevertically mounted, such that the internal electrode may be disposed tobe perpendicular with respect to the board.

Since other characteristics of the multilayered ceramic capacitoraccording to the secondary embodiment of the present invention are thesame as those of the multilayered ceramic capacitor according to thefirst embodiment of the present invention, a description of repeatedportions will be omitted.

FIG. 5 is a partially cut-away perspective view schematically showing amultilayered ceramic electronic component according to a thirdembodiment of the present invention.

FIG. 6 is an L-W cross-sectional view illustrating the multilayeredceramic capacitor of FIG. 5 cut in a thickness direction.

Referring to FIGS. 5 and 6, in a multilayered ceramic capacitor 1′according to the third embodiment of the present invention, a ‘lengthdirection’ refers to an ‘L’ direction of FIG. 5, a ‘width direction’refers to a ‘W’ direction thereof, and a ‘thickness direction’ refers toa ‘T’ direction thereof. Here, the ‘thickness direction’ may be the sameas a direction in which the dielectric layers are stacked, that is, a‘stacking direction’.

As shown in FIGS. 5 and 6, a multilayered ceramic electronic componentprovided according to the third embodiment of the present invention mayinclude: a ceramic body having a hexahedral shape, including adielectric layer, satisfying T/W>1.0 when a length thereof is L, a widththereof is W, and a thickness thereof is T, and having first and secondend surfaces opposing each other in a length direction and first andsecond side surfaces opposing each other in a width direction; aplurality of first and second internal electrodes disposed in theceramic body so as to be alternately exposed through the first andsecond end surfaces, having the dielectric therebetween; first andsecond external electrodes electrically connected to the first andsecond internal electrodes, respectively; and insulation layers formedon the first and second side surfaces, wherein the insulation layercovers regions of the first and second external electrodes formed on thefirst and second side surfaces.

As shown in FIGS. 5 and 6, characteristics of a ceramic body 10′ of themultilayered ceramic capacitor according to the third embodiment of thepresent invention are the same as those of the ceramic body 10 of themultilayered ceramic capacitor according to the first embodiment of thepresent invention, and therefore, a description of repeated portionswill be omitted.

Meanwhile, first and second external electrodes 31′ and 32′ of themultilayered ceramic capacitor according to the third embodiment of thepresent invention may be formed on the first and second side surfaces.

In other words, the first and second external electrodes 31′ and 32′according to the present embodiment may include the head parts formed onthe first and second end surfaces to which the first and second internalelectrodes 21′ and 22′ are exposed and the band parts extended from thehead parts to the first and second main surfaces and the first andsecond side surfaces.

Meanwhile, according to the present embodiment, the external electrodeis formed on the side surface of the ceramic body, thereby causing theshort-circuit when the multilayer ceramic capacitor topples over at thetime of being mounted on the board. Therefore, in order to prevent theshort-circuit, the insulation layer 41 formed on the first and secondside surfaces so as to cover the external electrodes formed on the firstand second side surfaces may be further included in the multilayeredceramic capacitor according to the embodiment of the present invention.

Therefore, in the case in which the first and second external electrodes31′ and 32′ are extended to the first and second side surfaces of theceramic body 10′ in the same manner as the related art, even when themultilayered ceramic capacitor topples over in the width direction atthe time of being mounted on the board, the short-circuit generatedbetween the multilayered ceramic capacitors adjacent to each other maybe prevented and the mounting density may be improved, due to theinsulation layer 41 covering regions of the second external electrodes31′ and 32′ formed on the first and second side surfaces.

FIG. 7 is a partially cut-away perspective view schematically showing amultilayered ceramic electronic component according to a fourthembodiment of the present invention.

FIG. 8 is an L-W cross-sectional view illustrating the multilayeredceramic capacitor of FIG. 7 cut in a thickness direction.

Referring to FIGS. 7 and 8, in a multilayered ceramic capacitor 100′according to the fourth embodiment of the present invention, a ‘lengthdirection’ refers to an ‘L’ direction of FIG. 7, a ‘width direction’refers to a ‘W’ direction thereof, and a ‘thickness direction’ refers toa ‘T’ direction thereof. Here, the ‘width direction’ may be the same asa direction in which the dielectric layers are stacked, that is, a‘stacking direction’.

That is, as shown in FIGS. 7 and 8, in the multilayered ceramiccapacitor 100 according to the fourth embodiment of the presentinvention, the direction in which the dielectric layers are stacked maybe the width direction of the ceramic body 110′, unlike theabove-described multilayered ceramic capacitor according to the thirdembodiment of the present invention.

When the multilayered ceramic capacitor 100′ according to the fourthembodiment of the present invention is mounted on the board to bedescribed below, the multilayered ceramic capacitor 100′ may bevertically mounted, such that the internal electrode may be disposed tobe perpendicular with respect to the board.

Since other characteristics of the multilayered ceramic capacitoraccording to the fourth embodiment of the present invention are the sameas those of the multilayered ceramic capacitor according to the thirdembodiment of the present invention, a description of repeated portionswill be omitted.

Board for Mounting Multilayered Ceramic Capacitor

FIG. 9 is a perspective view showing a state in which the multilayeredceramic capacitor of FIG. 1 is mounted on a printed circuit board.

FIG. 10 is a perspective view showing a state in which the multilayeredceramic capacitor of FIG. 5 is mounted on the printed circuit board.

Referring to FIG. 9, a board 200 for mounting the multilayered ceramiccapacitor 1 according to the embodiment of the present invention mayinclude a printed circuit board 210 having the multilayered ceramiccapacitor 1 mounted thereon, and first and second electrode pads 221 and222 formed on the printed circuit board 210 so as to be spaced apartfrom each other.

Here, the multilayered ceramic capacitor 1 may be electrically connectedto the printed circuit board 210 by a solder 230 in a state in which thefirst and second external electrodes 31 and 32 are positioned so as tocontact the first and second electrode pads 221 and 222, respectively.

In addition, referring to FIG. 6, the board 200 for mounting themultilayered ceramic capacitor 100 according to another embodiment ofthe present invention may include a printed circuit board 210 having themultilayered ceramic capacitor 1 mounted thereon, and first and secondelectrode pads 221 and 222 formed on the printed circuit board 210 so asto be spaced apart from each other.

In the board for mounting the multilayered ceramic electronic componentaccording to another embodiment of the present invention, the externalelectrodes may not be formed on the side surface of the ceramic body, oreven when the external electrodes are formed on the side surfaces of theceramic body and the multilayered ceramic capacitor topples over in thecase that the multilayered ceramic capacitor is mounted on the board,the short-circuit does not occur due to the insulation layer coveringthe external electrodes formed on the side surfaces.

As a result, the multilayered ceramic capacitor having high capacitanceand excellent reliability may be implemented and the mounting densitymay be improved.

As set forth above, according to the embodiment of the presentinvention, even when the multilayered ceramic electronic componenttopples over at the time of being mounted on the board, the multilayeredceramic electronic component capable of preventing the occurrence ofshort-circuit and the board for mounting the same may be provided.

While the present invention has been shown and described in connectionwith the embodiments, it will be apparent to those skilled in the artthat modifications and variations can be made without departing from thespirit and scope of the invention as defined by the appended claims.

What is claimed is:
 1. A multilayered ceramic electronic componentcomprising: a ceramic body having a hexahedral shape, including adielectric layer, satisfying T/W>1.0 when a length thereof is L, a widththereof is W, and a thickness thereof is T, and having first and secondmain surfaces opposing each other in a thickness direction, first andsecond end surfaces opposing each other in a length direction, and firstand second side surfaces opposing each other in a width direction; aplurality of first and second internal electrodes disposed in theceramic body so as to be alternately exposed through the first andsecond end surfaces, having the dielectric therebetween; and first andsecond external electrodes electrically connected to the first andsecond internal electrodes, respectively, wherein the first and secondexternal electrodes are electrically connected to the exposed portionsof the first and second internal electrodes, respectively, include firstand second head parts formed on the first and second end surfaces,respectively, and first and second band parts formed on the first andsecond main surfaces, respectively, and are not formed on the first andsecond side surfaces.
 2. The multilayered ceramic electronic componentof claim 1, wherein L/W>1.0 is satisfied.
 3. The multilayered ceramicelectronic component of claim 1, wherein the first and second internalelectrodes are stacked in the thickness direction of the ceramic body.4. The multilayered ceramic electronic component of claim 1, wherein thefirst and second internal electrodes are stacked in the width directionof the ceramic body.
 5. The multilayered ceramic electronic component ofclaim 1, wherein when an average thickness of the dielectric layer istd, 0.1 μm≦td≦0.6 μm is satisfied.
 6. The multilayered ceramicelectronic component of claim 1, wherein a thickness of each of thefirst and second internal electrodes is 0.6 μm or less.
 7. Themultilayered ceramic electronic component of claim 1, wherein the numberof stacked dielectric layers is 500 and more.
 8. A multilayered ceramicelectronic component comprising: a ceramic body having a hexahedralshape, including a dielectric layer, satisfying T/W>1.0 when a lengththereof is L, a width thereof is W, and a thickness thereof is T, andhaving first and second end surfaces opposing each other in a lengthdirection and first and second side surfaces opposing each other in awidth direction; a plurality of first and second internal electrodesdisposed in the ceramic body to be alternately exposed through the firstand second end surfaces, having the dielectric therebetween; first andsecond external electrodes electrically connected to the first andsecond internal electrodes, respectively; and insulation layers formedon the first and second side surfaces, wherein the insulation layerscover regions of the first and second external electrodes formed on thefirst and second side surfaces.
 9. The multilayered ceramic electroniccomponent of claim 8, wherein L/W>1.0 is satisfied.
 10. The multilayeredceramic electronic component of claim 8, wherein the first and secondinternal electrodes are stacked in a thickness direction of the ceramicbody.
 11. The multilayered ceramic electronic component of claim 8,wherein the first and second internal electrodes are stacked in thewidth direction of the ceramic body.
 12. The multilayered ceramicelectronic component of claim 8, wherein when an average thickness ofthe dielectric layer is td, 0.1 μm≦td≦0.6 μm is satisfied.
 13. Themultilayered ceramic electronic component of claim 8, wherein athickness of each of the first and second internal electrodes is 0.6 μmor less.
 14. The multilayered ceramic electronic component of claim 8,wherein the number of stacked dielectric layers is 500 and more.
 15. Aboard for mounting a multilayered ceramic electronic component, theboard comprising: a printed circuit board having first and secondelectrode pads disposed thereon; and a multilayered ceramic electroniccomponent installed on the printed circuit board, wherein themultilayered ceramic electronic component includes: a ceramic bodyhaving a hexahedral shape, including a dielectric layer, satisfyingT/W>1.0 when a width thereof is W, and a thickness thereof is T, andhaving first and second main surfaces opposing each other in a thicknessdirection, first and second end surfaces opposing each other in a lengthdirection, and first and second side surfaces opposing each other in awidth direction; a plurality of first and second internal electrodesdisposed in the ceramic body to be alternately exposed through the firstand second end surfaces, having the dielectric layer therebetween; andfirst and second external electrodes electrically connected to the firstand second internal electrodes, respectively, and wherein the first andsecond external electrodes are electrically connected to the exposedportions of the first and second internal electrodes, respectively,include first and second head parts formed on the first and second endsurfaces, respectively, and first and second band parts formed on thefirst and second main surfaces, respectively, and are not formed on thefirst and second side surfaces.
 16. A board for mounting a multilayeredceramic electronic component, the board comprising: a printed circuitboard having first and second electrode pads disposed thereon; and amultilayered ceramic electronic component installed on the printedcircuit board, wherein the multilayered ceramic electronic componentincludes: a ceramic body having a hexahedral shape, including adielectric layer, satisfying T/W>1.0 when a width thereof is W, and athickness thereof is T, and having first and second end surfacesopposing each other in a length direction, and first and second sidesurfaces opposing each other in a width direction; a plurality of firstand second internal electrodes disposed in the ceramic body to bealternately exposed through the first and second end surfaces, havingthe dielectric therebetween; first and second external electrodeselectrically connected to the first and second internal electrodes,respectively; and insulation layers formed on the first and second sidesurfaces, and the insulation layers cover regions of the first andsecond external electrodes formed on the first and second side surfaces.